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We are looking for key corporate and engineering staff with exceptional talent and skills to join us and make a great team even better.
Candidates should have high energy, problem-solving personalities, strong written and oral communication capabilities, and the ability to thrive within a dynamic start-up environment.
Notice to recruiters: Please do not submit unsolicited resumes without first contacting WiSpry’s HR department. Any submissions are considered property of WiSpry, Inc.
Please send inquiries to jobs@wispry.com referencing job posting number and position
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Job Posting M083111-BN Senior MEMS Packaging Engineer OR Packaging Engineering Manager (No Recruiters Please)
Job Description and Essential Duties:
The Sr. MEMS Packaging Engineer or Packaging Engineering Manager will work with the Engineering and Operations Teams to develop packaging requirements, complete development and qualification for new product introductions of Tunable RF products based on an Integrated CMOS+MEMS Process Technology.
The candidate should have 10+ years experience developing, qualifying and sustaining high volume packaging processes at USA and/or off-shore subcontract facilities. This requires experience in effectively dealing with large subcontractors and introducing new products. The candidate should have proven experience in Supplier Management to assure suppliers meet WiSpry’s requirements for quality, reliability and uninterrupted supply. This requires a strong background in process characterization and qualification. This job will require some travel as required to evaluate, qualify and ramp production at the production sites.
This position will be responsible for performing finite element analysis of the product at the die-level, package-level, and board-level. To accomplish this task, the engineer will need to have an excellent understanding of state-of-the-art packaging technology, materials, and processes. In addition, the candidate should be familiar with Wafer-Level Encapsulation of MEMS devices and successful demonstration of hermeticity. The candidate should be familiar with techniques for characterizing the thermo-mechanical behavior of 0th-, 1st-, and 2nd-level packaging behavior. The candidate should be proficient using CAD tools for substrate and package design.
Education and/or Experience:
- B.S. or M.S. in Mechanical Engineering, Electrical Engineering, Materials Science, Chemical Engineering or related formal education.
- 10 years of electronic packaging experience, preferably including MEMS packaging experience. Wafer-level encapsulation of MEMS devices and 1st-level packaging is preferred.
- Experienced Finite Element Analyst should be an expert with non-linear finite element analysis for modeling hygro-thermo-mechanical behavior of packages, modeling shock/drop reliability, and modeling failure modes associated with fracture, delamination, moisture absorption, and large deformations. Specific experience with Abaqus is preferred and experience with CoventorWare is beneficial. Experience with other FEA software and analytical tools such as Matlab will be beneficial.
- Experienced with package characterization using strain measurement transducers, Moire, Electronic Speckle Interferometry, or white light interferometetry using a Wyko system. Specific experience with Wyko measurement systems will be preferred. Experience with Failure Analysis techniques such as x-sectioning, X-ray microscopy, and Acoustic Microscopy will be beneficial.
- Experienced with the characterization of packaging materials using nano-indentation and DMA, including techniques to evaluate the hermeticity of MEMS encapsulations and characterize the permeability of moisture barriers.
- Experienced using CAD design tools for substrate/package design. Experience working directly with packaging materials and assembly/packaging sub-contractors is required.
- Experience with a range of state-of-the-art packaging techniques including but not limited to flip-chip assembly, redistribution layer processes, CSP, WLCSP, Wafer-Level Encapsulation, Underfill and Overmolding techniques. Experience with lead-free material systems.
- Operating knowledge of JEDEC standards for qualification of packaged products and for packaging standards.
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