|
WiSpry is growing! We are looking for key corporate and engineering staff with exceptional talent and skills to join us and make a great team even better.
Candidates should have high energy, problem-solving personalities, strong written and oral communication capabilities, and the ability to thrive within a dynamic start-up environment.
Notice to recruiters: Please do not submit unsolicited resume’s without first contacting WiSpry’s HR department. Any submissions are considered property of WiSpry, Inc.
Please send inquiries to jobs@wispry.com referencing job posting number and position
Job Posting - D010615SC - Senior MEMS Packaging Engineer
Job Description and Essential Duties:
The Sr. MEMS Packaging Engineer will work with the MEMS Engineering and Operations Teams to develop packaging requirements for Tunable RF products based on an Integrated MEMS Technology. This position will be responsible for performing finite element analysis of the product at the die-level, package-level, and board-mounted level. To accomplish this task, the engineer will need to have an excellent understanding of state-of-the-art packaging technology, materials, and processes. In addition, the MEMS Packaging Engineer should be familiar with Wafer Level Encapsulation of MEMS devices and successful demonstration of hermeticity. The MEMS Packaging Engineer should be familiar with techniques for characterizing the thermo-mechanical behavior of 0th-, 1st-, and 2nd-level packaging behavior.
Education and/or Experience
M.S. in Mechanical Engineering, Applied Mechanics, Materials Engineering or Civil Engineering; Ph.D. preferred
5-10 years of electronic packaging experience and preferentially MEMS packaging experience. Wafer level encapsulation of MEMS devices experience is preferred.
Experienced Finite Element Analyst should be an expert with non-linear finite element analysis for modeling hygro-thermo-mechanical behavior of packages, modeling shock/drop reliability, and modeling failure modes associated with fracture, delamination, moisture absorption, and large deformations. Specific experience with Abaqus is preferred and experience with CoventorWare is beneficial. Experience with other FEA software and analytical tools such as Matlab will be beneficial.
Experienced with package characterization using strain measurement transducers, Moire, Electronic Speckle Interferometry, or white light interferometetry using a Wyko system. Specific experience with Wyko measurement systems will be preferred. Experience with Failure Analysis techniques such as x-sectioning, X-ray microscopy, and Acoustic Microscopy will be beneficial.
Experienced with the characterization of packaging materials using nano-indentation and DMA, including techniques to evaluate the hermeticity of MEMS encapsulations and characterize the permeability of moisture barriers.
Experience with a range of state-of-the-art packaging techniques including but not limited to flip-chip assembly, redistribution layer processes, CSP, WLP, Wafer Level Encapsulation, Underfill and Overmolding techniques. Experience with lead-free material systems.
Operating knowledge of JEDEC standards for qualification of packaged products and for packaging standards.
Job Posting - M100616NI - Product Test Validation Engineer
Job Description and Essential Duties:
Lab bench automation including Maury load pull, bench screening programs, reliability testing / automation, and lab wafer probe tests/ automations; Data analysis and reporting for bench data, reliability data, as well as production ATE test data; Support product bench test validation and data analysis and reporting of test results (non linear and spurious RF measurements, switching time analysis of MEMS devices, RTG testing…etc); Support lab wafer probe testing including data analysis and reporting; Support package, process and device qualifications as required; Evaluate and debug new silicon on bench and ATE; report technical data back to engineering teams; Resolve customer issues and RMA’s through ATE and bench analysis.
Education and/or Experience
Minimum education: Bachelors degree in Electrical Engineering or Computer Science is preferred.
Minimum 5 years experience in semiconductor industry is preferred; Product Engineering experience and/ or Test engineering on ATE platforms is a plus.
Lab-View programming skills / Lab-Windows Platform within XP. Coded software that communicates with test equipment (Call-Box, Signal Sources, etc.); Ability to understand a specific communications protocol (Blue-Tooth, Phone-Com-Port, etc.) and then code software to establish communications and control; Understanding of typical Cellular RF Test and Measurement procedures (GSM/EDGE & CDMA);RF matching and de-embedding knowledge and experience; Experience using JMP statistical tool for data analysis and script codes; Experience using lab bench test equipment; SA, VNA, LCR meter, Sig-Gen,…etc including wafer-level probing; Familiar with PCB layout and RF design tools is a plus; Good computer skills (i.e. Excel, JMP, Power Point…etc); Experience handling wafers and ESD sensitive parts; RF Test Development and Test Methodology; including but not limited to: S-Parameters, IP3, Q-factor measurements, I2C & SPI interfaces…etc
Job Posting - S100708LB - Embedded Systems Software Application Engineer
Job Description and Essential Duties:
The Embedded Systems Software Applications Engineer is responsible for the coding, development and implementation of WiSpry’s proprietary tuning algorithms into wireless systems. Responsibilities include coordination of engineering resources with eco-system partners (transceiver & BB OEMs, handset manufacturers , and module OEMs). Additional responsibilities include providing input and feedback into WiSpry’s roadmap and advanced development.
· System level definition, partitioning and high level code systemization
· Definition of interfaces between modules within the system
· Definition of interface modules to specific hardware platforms
· Specification of subsystem performance, processor loading & memory requirements.
· Partitioning of RTOS modules and application layer modules and interfaces
· Work with baseband chipset suppliers design teams on requirements, definition and verification of software modules and interfaces
· Coding for minimum memory, processor loading and general system impact
· Function as primary liaison to MIPI for SW-HW interface specification maturation and documentation
Education and/or Experience
· Minimum of 10 years industry experience with at least 5 years working with wireless applications. Less experiences applicants with higher ratio of wireless experience will also be considered.
· Experience with coding in the ARM or equivalent environment etc. is required.
· Experience with interrupts, timing etc in an RTOS is required.
· Experience with LabView or testing environment desired but not a requirement
· Experience with handset baseband & /or transceiver development in any form a plus, as is experience with hardware and antenna products.
- Required: Bachelor's, Computer Engineering and/or Computer Science and/or Electrical Engineering.
- Masters Degree is preferred.
Location: Irvine, CA (preferred), Raleigh/Durham, NC; Seoul, South Korea also considered.
|
