Brad Nelson brings over 25 years of management and technical experience in the semiconductor and RFMEMS industries in development, technology transfer and volume manufacturing.  Nelson was previously Vice President of operations for Teravicta Technologies.  He was responsible for migration of the company from the R&D mode to product development and manufacturing.  Prior to Teravicta he served as SRAM/ROM technology director for Motorola Corporation's Semiconductor Products Sector.  Additionally, he has held technical and management positions at Mostek, Harris Semiconductor, and Microelectronics and Computer Technology Corporation.  Nelson holds a Bachelor of Science degree in ceramic engineering from Clemson University and is the author of several patents.

Victor Steel has more than 20 years of experience in technical design, engineering, marketing and P&L management. Prior to WiSpry, Steel held various positions during a 15-year tenure at RFMD, where he was instrumental in helping the company become the largest supplier of cellular power amplifiers in the world. Among other achievements, Steel established RFMD’s international marketing program and managed the development and release of numerous generations of power amplifier products. Before RFMD, Steel worked at both Teledyne and ITT as a Microwave/RF Design Engineer. He earned both his B.S. and M.S. in Electrical Engineering from the University of Illinois, and has numerous patents, publications, and products in the field of wireless communications and circuits.