Designing RF-MEMS has not been without its challenges. The RF world is very unforgiving in both performance and environmental requirements. Meeting the stringent requirements and cost constraints demanded of handset components has required a laser-like focus on long term reliability and design-for-manufacture. To this end, WiSpry solutions have been engineered with reliability as an intrinsic part of their design.

While many of the constraints are simplified by leveraging the reliability inherent in high volume silicon manufacturing processes and their statistical process controls, WiSpry has overcome many key manufacturing challenges unique to MEMS.

These include yield problems such as, 'Stiction' where surface contacts do not properly release in the manufacturing process to long term operating effects such as the well known electrostatic charging effect where charge build up over long periods can cause the micro-actuators to fail in operation.

Unique and patented technology such as WiSpry's tri-layer beam design, coupled with a wealth of manufacturing knowledge and experience in anticipating problems in advance, allows us to build reliability in as a structural design feature. By doing so we can facilitate reliable, repeatable performance for RF-MEMS devices in handset applications and beyond.