One of the key steps to realizing the full potential of MEMS technologies is to leverage the wealth of expertise, know-how and manufacturing capacity afforded by the worldwide semiconductor industry.  At WiSpry, our fundamental approach from day one has been to develop a process that is not only compatible with that of leading semiconductor Fabs, but is explicitly designed to map directly onto their existing process steps. 

In fact, our first steps were to lay down the foundations for our technology by building a design library of proven components and processes which form the heart of our flexible, high performance manufacturing process.  This approach permits us access to high volume, low cost commercial facilities that can supply the demand we expect at the prices we know we will have to achieve.

Furthermore our low temperature process and wafer level packaging innovations permit our MEMS technology to be monolithically integrated with active silicon, delivering the highest possible performance at the lowest possible size and cost.

The resultant process is 'silicon agnostic' and can be built on top all leading RF processes, including CMOS, SiGe, BiCMOS and GaAs, opening up new avenues of integration, functionality and future architectural innovation.

	Standard Silicon FAB compatible MEMs Manufacturing Process
	- Standard 200mm Wafer Yields and Cost Model
	- Low Temperature Processes
	- CMOS, SiGE, GaAs compatible integration
	Patented Material and Structural Innovations
	Wafer Level Encapsulation
	Active Device Integration
	- Permits Further Level of Silicon Integration
	- Reduces Packaging Size and Cost
	- Roadmap to Fully Integrated Monolithic RF Front End