| One of the key steps to realizing the full potential of MEMS technologies is to leverage the wealth of expertise, know-how and manufacturing capacity afforded by the worldwide semiconductor industry. WiSpry’s fundamental approach has been to develop a process that is not only compatible with that of leading semiconductor Fabs, but is explicitly designed to map directly onto their existing process steps. The result is a leading-edge product design, at standard CMOS prices.
WiSpry’s technology foundation is a design library of proven components and CMOS-based processes which form the heart of our flexible, high performance manufacturing process. This approach allows us to use high volume, low cost commercial facilities that can supply the necessary demand at the price points we need to achieve for consumer adoption.
Furthermore our low temperature process and wafer level packaging innovations permit our MEMS technology to be monolithically integrated with active silicon, delivering the highest possible performance at the lowest possible size and cost.
WiSpry Process Innovations
- Standard Silicon FAB compatible MEMs Manufacturing Process
- Standard CMOS 200mm wafer yields and cost model
- Low temperature processes
- CMOS, SIGE, BiCMOS, GaAs compatible integration
- Patented Material and Structural Innovations
- Wafer Level Encapsulation
- Active Device Integration
- Permits further level of silicon integration
- Reduces packaging size and cost
- Roadmap to fully integrated monolithic RF front end
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